| Version |
Warning |
| 6.3 |
CAUTION - Via connections to both hatched and solid signal layer polygons are now controlled by the polygon connect style rule. Re-pouring polygons may result in physical copper differences. |
| Summer 09 |
CAUTION - File contains old violation objects. These violations are no longer supported & will not be loaded. Please run DRC after opening this file in order to refresh the violations. |
| Summer 09 |
CAUTION - Existing testpoint rules and settings are used as fabrication testpoint information. |
| Altium Designer update 19 |
CAUTION - Air Gap Width attribute was introduced to Polygon Connect Style Rule. Air Gap Width attribute now controls the distance between poured polygon and pads on the same net - this value was previosuly taken from clearance rule while ignoring net subscope leading to sometime unexpected results. |
| Release 13 |
CAUTION - Silkscreen Over Component Pads Rules are converted to Silk To Solder Mask Clearance Rules. Suggest examining rule scopes for accuracy. |